💻 Semiconductor Equipment Parts

We machine aluminum 6061-T6 and 5083 for chamber components, stainless steel 316L for wet process parts, titanium Grade 2 for wet etch baskets, PEEK and PTFE for chemical-resistant components, PCTFE (Kel-F) for cryogenic seals, and ceramic-compatible metal components for process modules. All materials conform to SEMI standards.

Yes. Electropolishing to Ra 0.25µm or better is available for 316L stainless steel components. Our electropolishing process removes the worked surface layer, exposing a clean, passive surface ideal for wet process and clean-room environments. We provide surface roughness measurements before and after electropolishing.

We follow SEMI F57 for component cleanliness. Parts are ultrasonically cleaned in DI water (18 MΩ·cm resistivity), nitrogen blow-dried, and double-bagged in Class 1000 clean-room bags. For critical applications, we offer Class 100 clean-room packaging with particle count verification per ISO 14644.

We hold ±0.01mm on O-ring groove dimensions and ±0.02mm on sealing surface flatness. For slit valve and gate valve sealing surfaces, we machine to Ra 0.4µm. Our vacuum sealing surfaces are leak-tested per customer specifications. Laser marking for UID/traceability is available.

Yes. We machine gas distribution blocks and manifolds from 316L stainless steel with surface finishes optimized for particle minimization. Internal passages are machined with smooth transitions — no sharp corners, no re-entrant features that could trap particles. All threads are gauged and all passages are deburred and verified via borescope.

Absolutely. Every semiconductor component ships with full material traceability: mill test reports, heat/lot numbers, material composition verification. For 316L components, we provide ferrite content measurement per ASTM A1084. All traceability documents are compiled in a single package per PO line item.